Note: The job is a remote job and is open to candidates in USA. NVIDIA is a leader in power, performance, and efficiency in the GPU and SOC markets, seeking a hard-working Senior Package Layout Engineer. The role involves collaborating with design teams to develop sophisticated layouts of IC substrates and addressing manufacturing and electrical design challenges.

Responsibilities

• As part of a Layout team, you will collaborate to implement high speed/density ASIC packages
• Perform substrate breakout patterns for ASIC packages
• Optimize package pinout incorporating system level trade-offs of pins assignment
• Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite
• Propose layout design trade-offs to the Technical Package Lead for resolution and implementation
• Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance
• Develop symbols and CAD library databases using Cadence APD design tools
• Develop methodologies to improve layout productivity

Skills

• Hold a B.S. Electrical Engineering or equivalent experience
• 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus
• Proven experience in substrate layout of wire bond and flip chip packages, preferred
• Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
• Solid understanding of high-speed design signal integrity practices
• Experience with Virtuoso and Calibre is a plus
• Experience using Valor is helpful

Benefits

• You will also be eligible for equity and benefits.

Company Overview

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